[Rickertsen2]

This seems to be a very common problem among teams. IFI slathers conformal coating all over the board except the FET heatsinks. Maybie they leave out the sinks for thermal reasons. If this is the case, why don't they use some anodized aluminum heatsinks.

The heatsinks would provide improved thermals and the anodization would provide some shaving protection.

The IFI people are smart. I would think that they would work toward a way to fix this issue. Sure its the team's fault, but competitor's speed controller designs do not have exposed FETs.