[Chriszuma]

Originally Posted by Rickertsen2

This seems to be a very common problem among teams. IFI slathers conformal coating all over the board except the FET heatsinks. Maybie they leave out the sinks for thermal reasons. If this is the case, why don't they use some anodized aluminum heatsinks.

The heatsinks would provide improved thermals and the anodization would provide some shaving protection.

The IFI people are smart. I would think that they would work toward a way to fix this issue. Sure its the team's fault, but competitor's speed controller designs do not have exposed FETs.

Well what they really should do is put some sort of rubber above the circuit board and below the heatsinks so little shavings can't slip into the holes in the case. Maybe we'll find a way to modify them.