[s1900ahon]

A couple of comments I would make to this presentation:
1. Wire cutters (especially when new) can be sharp. Watch your fingers.
2. I encourage our team (and others) to use ratcheting crimpers. The yellow handled tool shown in the slides is pure evil. Yeah, I know they're affordable, but they don't do as good a job at creating a secure connection.
3. No mention of wire gauge to the color of the terminal insulation. I.e. Using an incorrectly sized terminal for the wire may result in a crimp that will fail.
4. Maybe mention using non-insulated terminals, then crimp, solder, then insulate.
5. No mention of flux for soldering. The flux pens can be useful.
6. When soldering, I usually clean the tip first, then apply a small amount of solder to the tip of the iron (also having applied flux to the wires/components that I will be soldering). Having some molten solder on the tip aids the process. This is sort of shown in step 9 of the presented process.
7. Desoldering? Solder wick, etc.
8. Wow, a picture of a very early PD board.. with SLA'd enclosure and everything.
9. The digital breakout (DSC) can use a ribbon cable as an alternative to the cable provided in the KoP. Many teams use a ribbon cable because a) they can make it smaller (and lighter), and b) there is less stress on the connectors with a ribbon cable.